Testing Capabilities
comprehensive testing processes integrated into our Box Build and End Assembly services. Our testing capabilities include:
Test Plan Development
We collaborate with our clients to develop custom test plans tailored to each product’s functional requirements and use cases.
- Detailed requirement analysis
- Test strategy and architecture
- Definition of pass/fail criteria
- Coverage for firmware, hardware, and mechanical components
- Traceability to customer specifications and standards
ICT – In-Circuit Test
In-circuit testing ensures that every component is properly placed and soldered, and that the board functions correctly at the component level before final assembly.
- Pin-level testing for shorts/opens
- Component value verification (resistors, capacitors, etc.)
- Integrated circuit test
- Boundary scan and JTAG testing
- High throughput with minimal operator intervention
FCT – Functional Circuit Test
Functional testing simulates real-world operating conditions to ensure the assembled product meets all functional specifications.
- Power-on self-tests
- Firmware loading and validation
- Communication interface checks (USB, Ethernet, CAN, etc.)
- Simulation of end-use environments
- Custom test fixture development
Burn-In Testing
Burn-in testing subjects the product to elevated stress conditions to uncover early-life failures and ensure long-term reliability.
- Extended operation under high temperature and voltage
- Load cycling and environmental stress screening
- Continuous monitoring of key parameters
- Ideal for high-reliability applications (medical, aerospace, automotive)
Why Testing Matters
Our rigorous testing methodologies not only reduce RMA (Return Material Authorization) rates but also enhance customer confidence and product longevity. We provide full documentation and traceability for all test procedures and results.